SAN JOSE, Calif. — Malaysia’s Unisem Berhad has rolled out a new, high-density leadframe packaging technology. The Leadframe Grid Array (LFGA) is said to offer I/O densities traditionally only found ...
CHENGDU, China — Seeking to break out from the crowded IC-packaging pack, Malaysia’s Unisem Berhad here outlined its ambitious growth strategy amid robust demand and shortages in the market. As part ...
KUALA LUMPUR, Malaysia--(BUSINESS WIRE)--Unisem today announced the introduction of a new high density leadframe packaging technology, the Leadframe Grid Array (LFGA). This latest offering, developed ...
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